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Three-dimensional memory array and method of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Three-dimensional memory array incorporating serial chain...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Three-dimensional memory card structure with internal direct chi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Three-dimensional memory cells

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Three-dimensional memory cells

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Tunneling through region of reduced conductivity
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Three-dimensional memory device incorporating segmented bit...

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Plural recrystallized semiconductor layers
Reexamination Certificate

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Three-dimensional memory stacking using anisotropic epoxy...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Three-dimensional memory structure and manufacturing method...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
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Three-dimensional microelectronic devices including...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Three-dimensional module comprised of layers containing IC...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Three-dimensional monolithic electronic module having stacked pl

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Patent

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Three-dimensional multi-chip package having chip selection...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Three-dimensional multi-layer molded electronic device and metho

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent

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Three-dimensional multichip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Three-dimensional multichip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Three-dimensional multichip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Three-dimensional multichip package

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor
Patent

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Three-dimensional multichip packages and methods of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Patent

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Three-dimensional multichip stack electronic package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Three-dimensional multimodule HDI arrays with heat spreading

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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