Three-dimensional multi-layer molded electronic device and metho

Details Three-dimensional multi-layer molded electronic device and metho Three-dimensional multi-layer molded electronic device and metho

1996-05-03

1999-06-22

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257774, 257797, 257723, 257730, 257758, 257700, 257686, 438613, 438612, 438614, 438977, 1566571, H01L 2144, H01L 2316, H01L 2302, H01L 2944

Patent

active

059145340

ABSTRACT:
A three-dimensional multi-layer molded electronic device and method for manufacturing same, wherein the device comprises at least two molded, three-dimensional substrates having mating surfaces, each substrate including a layer of patterned conductive material on at least one surface and electrically conductive vias at selected locations of the substrate for interconnection of the conductive layers, wherein the substrates are electrically joined at their mating surfaces and the circuit layers are aligned and interconnected to form a multi-layer, three-dimensional circuit which may include molded-in structural features.

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