Three-dimensional monolithic electronic module having stacked pl

Details Three-dimensional monolithic electronic module having stacked pl Three-dimensional monolithic electronic module having stacked pl

1996-05-31

1997-06-10

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With peripheral feature due to separation of smaller...

257690, 257723, H01L 2700

Patent

active

056379129

ABSTRACT:
A fabrication method and resultant monolithic electronic module comprising a plurality of stacked planar extending arrays of integrated circuit chips. The fabrication method includes dicing a wafer of integrated circuit chips into a plurality of arrays of integrated circuit chips. The arrays of integrated circuit chips are then stacked to form an electronic module. A metallization pattern may be deposited on a substantially planar surface of the electronic module, and used to interconnect the various arrays of integrated circuit chips contained therein. Specific details of the fabrication method and resultant multi-chip package are set forth.

REFERENCES:
patent: 4398248 (1983-08-01), Hsia et al.
patent: 4646128 (1987-02-01), Carson et al.
patent: 4770640 (1988-09-01), Walter
patent: 4801992 (1989-01-01), Golubic
patent: 4897708 (1990-01-01), Clements
patent: 4965653 (1990-10-01), Otsuka et al.
patent: 4983533 (1991-01-01), Go
patent: 5025306 (1991-06-01), Johnson et al.
patent: 5075253 (1991-12-01), Sliwa, Jr.
patent: 5214657 (1993-05-01), Farnworth et al.
patent: 5266833 (1993-11-01), Capps

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