LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Chip size stack package and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip size stack package, memory module having the same, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Chip sized package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – By pressure alone

Chip sized semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip stack and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip stack employing a flex circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor

Chip stack package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip stack package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Chip stack package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Chip stack package and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip stack package utilizing a connecting hole to improve...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip stack package utilizing a dummy pattern die between...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip stack package, connecting board, and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip stack with differing chip package types

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip stack, chip stack package, and method of forming chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip stack-type semiconductor package and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Chip stacking by edge metallization

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip stacking structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Chip structure