Search
Selected: All

Chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package and method for manufacture thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package for power devices and method for making...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package having flip chip interconnect on die paddle

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package in which layout of wiring lines is improved

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package of semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package of semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package type of semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package using large ductile solder balls

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package with compliant leads

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package with direct attachment of chip to lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package with heat dissipating part

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package with heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package with heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale package with micro antenna and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale packages manufactured at wafer level

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip scale packages performed by wafer level processing

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0
  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.