Chip scale package with heat dissipating part

Details Chip scale package with heat dissipating part Chip scale package with heat dissipating part

2005-04-05

2005-04-05

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S796000, C257S684000, C257S666000, C257S696000, C257S698000, C257S737000, C257S738000, C257S784000, C257S786000, C257S787000, C257S712000, C257S675000, C257S676000, C257S673000

Reexamination Certificate

active

06876087

ABSTRACT:
In a chip scale package, a chip is mounted in a cavity formed in a leadframe. The leadframe includes a plurality of leads that radiate from a heat dissipating part located in the cavity. Each lead extends from a thinner portion of inner lead in the cavity to a thicker portion of outer lead outside the cavity. The chip includes a plurality of bonding pads on which is respectively formed a layer of connecting material. The chip is attached on the heat dissipating material, and via the layer of connecting material, is electrically connected to the inner leads by thermal pressing. Via molding, the chip is encapsulated in the leadframe. The achieved package has a dimensional size that is approximately equal to that of the leadframe with an improved thermal dissipation.

REFERENCES:
patent: 5648682 (1997-07-01), Nakazawa et al.
patent: 5933709 (1999-08-01), Chun
patent: 6130477 (2000-10-01), Chen et al.
patent: 6184580 (2001-02-01), Lin
patent: 6242798 (2001-06-01), Cha et al.
patent: 6376769 (2002-04-01), Chung
patent: 6414385 (2002-07-01), Huang et al.
patent: 6465876 (2002-10-01), Kitano et al.
patent: 6590281 (2003-07-01), Wu et al.
patent: 6597059 (2003-07-01), McCann et al.
patent: 6723585 (2004-04-01), Tu et al.
patent: 20030094677 (2003-05-01), Cheng
patent: 20040016995 (2004-01-01), Kuo et al.
patent: 8-116016 (1996-05-01), None
patent: 10-50921 (1998-02-01), None

Affiliated with

Also associated with

Rating

Chip scale package with heat dissipating part does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip scale package with heat dissipating part, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip scale package with heat dissipating part will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3440974