Chip scale package and method of fabricating the same

Details Chip scale package and method of fabricating the same Chip scale package and method of fabricating the same

2006-07-04

2006-07-04

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S737000

Reexamination Certificate

active

07071570

ABSTRACT:
A chip scale package has an insulating layer formed on the upper surface of a chip provided with a plurality of terminals on its one surface, a plurality of conductive layers formed on the insulating layer and spaced from each other by a designated distance so as to be connected to each of a plurality of the terminals, and a plurality of electrode surface layers formed on each of the upper surfaces of a plurality of the conductive layers.

REFERENCES:
patent: 5441898 (1995-08-01), Richards et al.
patent: 5554887 (1996-09-01), Sawai et al.
patent: 6177719 (2001-01-01), Huang et al.
patent: 6187615 (2001-02-01), Kim et al.
patent: 6205089 (2001-03-01), Itoh
patent: 6300686 (2001-10-01), Hirano et al.
patent: 6441500 (2002-08-01), Sumikawa et al.
patent: 6492198 (2002-12-01), Hwang
patent: 1246731 (2000-03-01), None
patent: 100 45 043 (2001-04-01), None
patent: 1 085 561 (2001-03-01), None
Patent Abstracts of Japan, Publication No. 08-340002, Dec. 24, 2996.
Patent Abstracts of Japan, Publication No. 09-102667, Apr. 15, 1997.
Patent Abstracts of Japan, Publication No. 11-121647, Apr. 30, 1999.

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