Very low dielectric constant plasma-enhanced CVD films
Very low effective dielectric constant interconnect...
Very low leakage JFET for monolithically integrated arrays
Very low magnetic field integrated circuit
Very low voltage actuated thyristor with centrally-located...
Very thin multi-chip package and method of mass producing...
Very thin PECVD SiO.sub.2 in 0.5 micron and 0.35 micron technolo
Via alignment, etch completion, and critical dimension...
Via antenna fix in deep sub-micron circuit designs
Via AP switching
Via attached to a bond pad utilizing a tapered interconnect
Via barrier layers continuous with metal line barrier layers...
Via bottom contact and method of manufacturing same
Via configurable architecture for customization of analog...
Via connection structure with a compensative area on the...
Via construction for structural support
Via formation in integrated circuit interconnects
Via formation in polymeric materials
Via gouged interconnect structure and method of fabricating...
Via hole having fine hole land and method for forming the same