Via construction for structural support

Details Via construction for structural support Via construction for structural support

2005-09-13

2005-09-13

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

C257S774000, C257S773000, C257S737000, C257S738000, C257S734000, C257S778000, C257S724000, C257S725000, C257S691000, C257S698000, C257S207000, C257S208000, C257S211000

Reexamination Certificate

active

06943446

ABSTRACT:
An integrated circuit having electrically conductive vias with a diameter of between about one micron and about fifty microns. Prior art vias have a diameter of between no less than 0.3 microns to no more than 0.8 microns. In this manner, stresses such as those that press down upon the top surface of the integrated circuit can be absorbed by the large vias and transferred past fragile layers, such as low k layers, so that the fragile layers are not damaged by the stresses.

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patent: 2004/0084781 (2004-05-01), Ahn et al.
patent: 2004/0099441 (2004-05-01), Ichiryu et al.

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