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Thermal interconnect systems methods of production and uses...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Thermal interconnect systems methods of production and uses...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Thermal interface

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
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Thermal interface apparatus, systems, and fabrication methods

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
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Thermal interface apparatus, systems, and fabrication methods

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
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Thermal interface apparatus, systems, and methods

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Thermal interface apparatus, systems, and methods

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Thermal interface attach mechanism for electrical packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Thermal interface material and heat sink configuration

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
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Thermal interface material and solder preforms

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Thermal interface material and solder preforms

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Thermal interface material design for enhanced thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Thermal interface material having carbon nanotubes and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Thermal interface material with carbon nanotubes

Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than... – Diamond or silicon carbide
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Thermal interface material with hotspot heat remover

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Thermal interface structure with integrated liquid cooling...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Thermal interface thickness control for a microprocessor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Thermal interface with a patterned structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Thermal interface with non-tacky surface

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Thermal interface with silver-filled carbon nanotubes

Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than... – Diamond or silicon carbide
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