Thermal interface apparatus, systems, and methods

Details Thermal interface apparatus, systems, and methods Thermal interface apparatus, systems, and methods

2008-07-15

2008-07-15

Smith, Zandra V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S748000, C257S720000

Reexamination Certificate

active

10458603

ABSTRACT:
An apparatus and system, as well as fabrication methods therefor, may include a substrate coupled to a first material and a second material. The first and second materials may comprise adjacent metals, and may have different coefficients of thermal expansion sufficient to reduce the amount of substrate warp that can occur due to heating and cooling.

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