Thermal interface material with carbon nanotubes

Details Thermal interface material with carbon nanotubes Thermal interface material with carbon nanotubes

2007-08-07

2007-08-07

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Specified wide band gap semiconductor material other than...

Diamond or silicon carbide

C977S712000, C977S735000, C977S742000, C977S743000, C977S842000, C977S848000, C977S855000, C977S856000

Reexamination Certificate

active

11024513

ABSTRACT:
A thermal interface material (40) includes a macromolecular material (32), and a plurality of carbon nanotubes (22) embedded in the macromolecular material uniformly. The thermal interface material includes a first surface (42) and an opposite second surface (44). Each carbon nanotube is open at both ends thereof, and extends from the first surface to the second surface of the thermal interface material. A method for manufacturing the thermal interface material includes the steps of: (a) forming an array of carbon nanotubes on a substrate; (b) submerging the carbon nanotubes in a liquid macromolecular material; (c) solidifying the liquid macromolecular material; and (d) cutting the solidified liquid macromolecular material to obtain the thermal interface material with the carbon nanotubes secured therein.

REFERENCES:
patent: 6350488 (2002-02-01), Lee et al.
patent: 6407922 (2002-06-01), Eckblad et al.
patent: 2003/0111333 (2003-06-01), Montgomery et al.
patent: 2004/0097635 (2004-05-01), Fan et al.
patent: 2005/0061496 (2005-03-01), Matabayas, Jr.
patent: 2006/0073332 (2006-04-01), Huang et al.

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