Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2007-03-06
2007-03-06
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S775000, C257S779000, C257SE23040, C257SE23041, C257SE21508
Reexamination Certificate
active
10722288
ABSTRACT:
A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
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Hareesh Mavorri et al, Universal Solders for Direct and Powerful Bonding on Semiconductors, Diamond, and Optical Materials, Applied Physics Letter, May 7, 2001, pp. 2976-2978 vol. 78, No. 19.
International Search Report, PCT/US02/15870, dated Apr. 10, 2003, 4 pages.
Hozer Leszek
Ingham Anthony E.
Kyaw David V.
Laughlin John P.
Lewis Brian G.
Clark Jasmine
Fry's Metals, Inc.
Senniger Powers
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