Thermal interface with silver-filled carbon nanotubes

Details Thermal interface with silver-filled carbon nanotubes Thermal interface with silver-filled carbon nanotubes

2006-12-12

2006-12-12

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Specified wide band gap semiconductor material other than...

Diamond or silicon carbide

C257S014000, C428S332000, C428S408000, C427S430100, C427S249100

Reexamination Certificate

active

07148512

ABSTRACT:
An exemplary thermal interface (40) includes a silver colloid base (32), and an array of carbon nanotubes (22) disposed in the silver colloid base uniformly. The carbon nanotubes have nanometer-scale silver filled therein, are substantially parallel to each other, and extend from a first surface (42) to a second surface (44) of the thermal interface.

REFERENCES:
patent: 6350488 (2002-02-01), Lee et al.
patent: 6407922 (2002-06-01), Eckblad et al.
patent: 2005/0136248 (2005-06-01), Leu et al.
Berber et al., “Unusually High Thermal Conductivity of Carbon Nanotubes,” vol. 84, No. 20,Physical Review Letters, 2000, pp. 4613-4616.
Fan et al., “Self-Oriented Regular Arrays of Carbon Nanotubes and Their Field Emission Properties,” vol. 283,Science, 1999, pp. 512-514.
Liu et al., “Isotope Labeling of Carbon Nanotubes and Formation of12C—13C Nanotube Junctions,” vol. 123,J. Am. Chem. Soc., 2001, pp. 11502-11503.

Affiliated with

Also associated with

Rating

Thermal interface with silver-filled carbon nanotubes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal interface with silver-filled carbon nanotubes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal interface with silver-filled carbon nanotubes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3660367