Thermal interface apparatus, systems, and fabrication methods

Details Thermal interface apparatus, systems, and fabrication methods Thermal interface apparatus, systems, and fabrication methods

2008-01-08

2008-01-08

Lam, Cathy F. (Department: 1775)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S779000, C257S788000, C257S791000, C257S793000

Reexamination Certificate

active

11368708

ABSTRACT:
An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material.

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