LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Resin encapsulated pin grid array and method of manufacturing th

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Resin encapsulated semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Resin encapsulated semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...

Resin encapsulated semiconductor device and method for manufactu

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Resin encapsulated semiconductor device and the production...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Resin encapsulated semiconductor device having a reduced thickne

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Resin encapsulated semiconductor device with an electrically ins

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Resin encapsulation semiconductor device utilizing grooved...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Resin encapsulation type semiconductor device having an improved

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Resin for optical-semiconductor-element encapsulation...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Resin for sealing compound semiconductor, semiconductor device,

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – With textured surface

Resin for semiconductor wire

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Resin mold field effect semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Resin mold package structure of integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Resin mold semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Resin mold semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Resin mold type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Resin mold type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Resin molded charge coupled device package and method for prepar