Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent
1994-03-08
1997-07-15
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
257791, H01L 2328
Patent
active
056486871
ABSTRACT:
A resin for sealing a compound semiconductor is here disclosed which contains, as a matrix, a siloxane compound for producing a silicone resin by addition reaction and which has a group comprising the bond of an organic group and an oxy group. The group comprising the bond of the organic group and the oxy group bonds to a terminal of the molecule of the siloxane compound, and as this group comprising the bond, 0.1 to 10% by weight, preferably 0.1 to 1.5% by weight of an alkoxy group (--OR') is used. A compound semiconductor chip is covered with the resin for sealing the compound semiconductor and then reacted under predetermined conditions to produce a silicone resin and simultaneously to chemically bond a siloxane group (--Si--O--) in the silicone resin to an element in a portion of the compound semiconductor chip which comes in contact with the silicone resin.
REFERENCES:
patent: 3904583 (1975-09-01), Saunders et al.
patent: 4278784 (1981-07-01), Wong et al.
patent: 4410645 (1983-10-01), Das et al.
patent: 5013808 (1991-05-01), Piskoli
patent: 5294835 (1994-03-01), Igarashi et al.
Kusuda Kazuo
Matsumura Tsuneo
Matsuo Yoshihiko
Sata Naoki
Yoshikawa Toshihumi
Clark S. V.
Saadat Mahshid D.
Sharp Kabushiki Kaisha
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