Resin encapsulated pin grid array and method of manufacturing th

Details Resin encapsulated pin grid array and method of manufacturing th Resin encapsulated pin grid array and method of manufacturing th

1991-08-23

1993-08-03

Wojciechowicz, Edward

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

257697, 257784, H01L 2302

Patent

active

052332250

ABSTRACT:
A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

REFERENCES:
patent: 3783345 (1974-01-01), Taylor et al.
patent: 4266239 (1981-05-01), Miyagaki et al.
patent: 4541005 (1985-09-01), Hunter et al.
patent: 4823234 (1989-04-01), Konishi et al.

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