Resin molded charge coupled device package and method for prepar

Details Resin molded charge coupled device package and method for prepar Resin molded charge coupled device package and method for prepar

1994-11-07

1996-07-09

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

257666, 257680, 257787, H01L 31203, H01L 23495

Patent

active

055347258

ABSTRACT:
A resin molded CCD package and a method for preparing the CCD package by employing a transfer molding using a low-priced plastic material having a good moldability. This package comprises a semiconductor chip as a CCD, a lead frame being integrally provided with a paddle and a plurality of leads, a film wall being attached to an upper surface of the semiconductor chip such that it surrounds a light reception region of the semiconductor chip, a glass lid for sealing the light reception region and transmitting an outside light to the region, a plurality of metal wires for electrically connecting a plurality of bond pads of the semiconductor chip to individual inner leads of the lead frame, and a mold resin package body for hermetically sealing a predetermined part including the semiconductor chip and the inner leads, both being wire-bonded to each other. The present invention simplifies the preparation process of the CCD package, reduces the preparation cost and achieves the recent trend of compactness and requirement of mass production of the CCD package.

REFERENCES:
patent: 4388525 (1983-06-01), Phy
patent: 4501637 (1985-02-01), Mitchell et al.
patent: 4523102 (1985-06-01), Kazufumi et al.
patent: 4585513 (1986-04-01), Gale et al.
patent: 4707725 (1987-11-01), Ito
patent: 5021888 (1991-06-01), Kondou et al.

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