Resin encapsulated semiconductor device

Details Resin encapsulated semiconductor device Resin encapsulated semiconductor device

1992-07-07

1994-02-22

Wojciechowicz, Edward

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

257675, 257702, 257706, H01L 2348

Patent

active

052890392

ABSTRACT:
A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

REFERENCES:
patent: 3783345 (1974-01-01), Taylor et al.
patent: 4266239 (1981-05-01), Miyagaki et al.
patent: 4541005 (1985-09-01), Hunter et al.
patent: 4823234 (1989-04-01), Konishi et al.
patent: 4878108 (1989-10-01), Phelps et al.

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