Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent
1994-09-09
1995-11-28
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
257666, 257669, 257670, 257671, 257696, 361813, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
054710979
ABSTRACT:
A semiconductor device encapsulated with a synthetic resin portion, includes a semiconductor chip, a plurality of leads each electrically connected at one end thereof to the semiconductor chip and bent to have a gull-wing like shape extending outwardly from the synthetic resin portion, and an insulating support member provided in a flat portion nearer to the resin portion than a bottom soldering face of the leads of the gull-wing like shape. The leads are fixed to each other by means of the insulating support member. The semiconductor device has an improved lead alignment even if the leads are each very thin and aligned with fine pitch. Such a semiconductor device can be assuredly mounted on a printed board or the like with ease together with mounting the semiconductor device on the printed board type components, thereby contributing to acquisition of a highly reliable electronic device.
REFERENCES:
patent: 4796080 (1989-01-01), Phy
patent: 5051813 (1991-09-01), Schneider et al.
patent: 5176366 (1993-01-01), Masumoto et al.
patent: 5281851 (1994-01-01), Mills et al.
patent: 5285104 (1994-02-01), Kondo et al.
Crane Sara W.
Jr. Carl Whitehead
Rohm & Co., Ltd.
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