Resin mold package structure of integrated circuit

Details Resin mold package structure of integrated circuit Resin mold package structure of integrated circuit

1992-09-11

1993-11-23

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257676, 257783, 257666, H01L 2348

Patent

active

052647307

ABSTRACT:
A hybrid integrated circuit is provided having a substrate with at least one active and passive element disposed thereon. A lead frame has a plurality of leads and a support plate. The support plate supports the substrate. The support plate and inner leads are encapsulated in a resin mold package. An opening is formed in the support plate to thermally connect the bottom surface of the substrate to the resin mold package, and a plurality of devoid portions are formed in the substrate causing the amount of edge area contacting the resin mold package to be increased and adhesion between the substrate and the resin mold package improved.

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