Resin encapsulation semiconductor device utilizing grooved...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Reexamination Certificate

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Details

C257S672000, C257S676000, C257S730000, C257S784000, C257S787000, C361S773000, C361S813000

Reexamination Certificate

active

06909168

ABSTRACT:
A resin-encapsulation semiconductor device of this invention includes a die pad for mounting a semiconductor element; a plurality of supporting leads; a semiconductor element; a plurality of leads disposed to have tips thereof opposing the die pad; metal wires; and an encapsulation resin for encapsulating the die pad excluding a bottom thereof, the leads excluding bottoms and outside edges thereof, connecting regions with the metal wires, the supporting leads and the semiconductor element. The outside edges of the leads are disposed on substantially the same plane as the side face of the encapsulation resin, and the tip of each lead has a thin portion where the thickness is reduced in an upper face thereof.

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patent: 6166430 (2000-12-01), Yamaguchi
patent: 6204553 (2001-03-01), Liu et al.
patent: 6400004 (2002-06-01), Fan et al.
patent: 6638790 (2003-10-01), Minamio et al.
patent: 6642609 (2003-11-01), Minamio et al.
patent: 6650020 (2003-11-01), Yamada et al.
patent: 08250641 (1996-09-01), None
patent: 11-195733 (1999-07-01), None
patent: 11214606 (1999-08-01), None
patent: 2000012758 (2000-01-01), None
patent: 2001345411 (2001-12-01), None

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