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Selected: P

Package in package device for RF transceiver module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Package in package semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Package including a lead frame, a chip and a sealant

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Package including conductive layers having notches formed

Active solid-state devices (e.g. – transistors – solid-state diode – Contacts or leads including fusible link means or noise...
Patent

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Package lid or heat spreader for microprocessor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate

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Package mounted module and package board module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Package of a chip with beveled edges

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor
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Package of a semiconductor device with a flexible wiring...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Package of leadframe with heatsinks

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Package of leadframe with heatsinks

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Package of lightemitting diode with protective element

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate

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Package of semiconductor chip with array-type bonding pads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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Package of semiconductor device and its manufacturing method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Reexamination Certificate

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Package of solid-state imaging device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Package on package design to improve functionality and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Package on package substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Package on-package secure module having BGA mesh cap

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Package stacked semiconductor device having pin linking means

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Package stacking system with mold contamination prevention

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Package stacking through rotation

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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