Package of leadframe with heatsinks

Details Package of leadframe with heatsinks Package of leadframe with heatsinks

2008-04-29

2008-04-29

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S711000, C257S712000, C257S713000, C257S717000, C257S720000, C257S796000, C257SE33075, C257SE23051, C257SE23080, C257SE23102, C257SE23103, C257SE23105, C361S697000, C361S702000, C361S709000, C361S711000

Reexamination Certificate

active

11312461

ABSTRACT:
A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink is disposed on a first side of the leadframe and has a plurality of first positioning portions. The second heatsink is disposed on a second side of the leadframe. The second heatsink has a plurality of second positioning portions. The second positioning portions correspond to the first positioning portions of the first heatsink, whereby the warping problem of the leadframe is resolved.

REFERENCES:
patent: 5629561 (1997-05-01), Shin et al.
patent: 2005/0139974 (2005-06-01), Huang et al.

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