Package stacking system with mold contamination prevention

Details Package stacking system with mold contamination prevention Package stacking system with mold contamination prevention

2011-03-01

2011-03-01

Le, Dung A. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S712000, C257S777000, C257S778000, C257SE23169, C438S106000, C438S108000

Reexamination Certificate

active

07898072

ABSTRACT:
A package stacking system includes: providing a package substrate; mounting an integrated circuit over the package substrate; forming a step-down interposer over the integrated circuit; and molding a stack package body, having a step profile, on the package substrate and the step-down interposer.

REFERENCES:
patent: 6452268 (2002-09-01), Huang
patent: 6861288 (2005-03-01), Shim et al.
patent: 6870274 (2005-03-01), Huang
patent: 7187067 (2007-03-01), Weng et al.
patent: 7192798 (2007-03-01), Okada et al.
patent: 2005/0285258 (2005-12-01), Chen et al.
patent: 2009/0283888 (2009-11-01), Choi et al.

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