Package including a lead frame, a chip and a sealant

Details Package including a lead frame, a chip and a sealant Package including a lead frame, a chip and a sealant

2011-08-30

2011-08-30

Le, Dung A. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S666000, C257S690000, C257S786000, C257SE23039

Reexamination Certificate

active

08008784

ABSTRACT:
A package and a fabricating method thereof are provided. The package includes a lead frame, a chip and a sealant. The lead frame has a notch and a plurality of first notch-side leads, a plurality of first notch-side pads, a plurality of second notch-side leads and a plurality of second notch-side pads. The first notch-side leads extend to a first side of the notch. The first notch-side pads are correspondingly disposed on the first notch-side leads. The second notch-side leads extend to a second side of the notch. The second notch-side pads are correspondingly disposed on the second notch-side leads. The sealant seals up the chip and the lead frame and exposes a lower surface of the lead frame. The notch exposes a portion of the sealant.

REFERENCES:
patent: 6730544 (2004-05-01), Yang
patent: 6812552 (2004-11-01), Islam et al.
patent: 2006/0170081 (2006-08-01), Gerber et al.

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