Package including conductive layers having notches formed

Details Package including conductive layers having notches formed Package including conductive layers having notches formed

1996-11-22

1998-08-11

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Contacts or leads including fusible link means or noise...

257692, 257774, 257775, 257923, 257728, 361774, 361777, H01L 2358, H01L 2362

Patent

active

057930988

ABSTRACT:
In a package including a substrate, a conductive layer formed within the substrate, an internal lead element connected via a first throughhole to the conductive layer, and an external lead element connected via a second throughhole to the conductive layer, notches are formed in the conductive layer in close proximity to the first and second throughholes.

REFERENCES:
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patent: 4714952 (1987-12-01), Takekawa et al.
patent: 5157477 (1992-10-01), Chance
patent: 5185651 (1993-02-01), Boezen
patent: 5264729 (1993-11-01), Rostoker et al.
patent: 5289036 (1994-02-01), Nishimato
patent: 5329162 (1994-07-01), Nadaoka
patent: 5331204 (1994-07-01), Kuroda et al.
patent: 5402318 (1995-03-01), Otsuka et al.
patent: 5461260 (1995-10-01), Varker et al.
patent: 5528083 (1996-06-01), Malladi et al.

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