Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Reexamination Certificate
2006-05-30
2006-05-30
Fourson, George (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With large area flexible electrodes in press contact with...
C257S730000, C257S780000
Reexamination Certificate
active
07053479
ABSTRACT:
A packaged semiconductor device structure comprises a semiconductor chip (20) having a bump electrode (5), a facing substrate (9) having on one face thereof a facing electrode (8) contacting an end face of the bump electrode (5) and a bonding agent (7) filled in between the semiconductor chip (20) and the facing substrate (9). The bump electrode (5) is of a double layer structure composed of a core part (5b) and a convex-shaped electrode end part (5a) fabricated above the core part (5b) separately from the core part.
REFERENCES:
patent: 5869904 (1999-02-01), Shoji
patent: 6404051 (2002-06-01), Ezawa et al.
patent: 6404062 (2002-06-01), Taniguchi et al.
patent: 0 766 310 (1997-04-01), None
patent: 4-082241 (1992-03-01), None
patent: 6-333931 (1994-12-01), None
patent: 07-122591 (1995-05-01), None
patent: 8-222573 (1996-08-01), None
patent: 11-186325 (1999-07-01), None
patent: 11-284022 (1999-10-01), None
patent: 11-297748 (1999-10-01), None
patent: 11-340269 (1999-12-01), None
patent: 2000-174050 (2000-06-01), None
International Preliminary Report (PCT/IPEA/409) (translated) issued for PCT/JP02/02836.
Notification of Transmittal of Copies of Translation of the International Preliminary Examination Report (PCT/IB/338) issued for PCT/JP02/02836.
First Examination Report - Chinese Patent Office with partial translation.
Citizen Watch Co. Ltd.
Fourson George
Toledo Fernando L.
LandOfFree
Package of semiconductor device and its manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Package of semiconductor device and its manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package of semiconductor device and its manufacturing method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3593330