Package stacking through rotation

Details Package stacking through rotation Package stacking through rotation

2011-08-09

2011-08-09

Tran, Thien F (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S784000

Reexamination Certificate

active

07994644

ABSTRACT:
A packaged microelectronic element includes a package element that further includes a dielectric element having a bottom face and a top face, first and second bond windows extending between the top and bottom faces, a plurality of chip contacts disposed at the top face adjacent to the first and second bond windows, and first and second sets of package contacts exposed at diagonally opposite corner regions of the top face, wherein the first and second sets conductively connected to the chip contacts. There is also a microelectronic element adjacent to the bottom face of the dielectric element, as well as bond wires extending through the first and second bond windows to conductively connect the microelectronic element to the chip contacts.

REFERENCES:
patent: 2007/0126102 (2007-06-01), Mohammed et al.

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