Package on package design to improve functionality and...

Details Package on package design to improve functionality and... Package on package design to improve functionality and...

2008-07-15

2008-07-15

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000

Reexamination Certificate

active

07400033

ABSTRACT:
Methods and apparatus to provide an improved package on package (PoP) design are described. In one embodiment, a central processing unit (CPU) package substrate and an embedded package (which may include one or more heat removal channels) are molded. Other embodiments are also described.

REFERENCES:
patent: 7000684 (2006-02-01), Kenny et al.
patent: 7092254 (2006-08-01), Monsef et al.
patent: 7230334 (2007-06-01), Andry et al.
patent: 2007/0210446 (2007-09-01), Andry et al.

Affiliated with

Also associated with

Rating

Package on package design to improve functionality and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package on package design to improve functionality and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package on package design to improve functionality and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2808919