Package of lightemitting diode with protective element

Details Package of lightemitting diode with protective element Package of lightemitting diode with protective element

2005-03-01

2005-03-01

Whitehead, Jr., Carl (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

Reexamination Certificate

active

06861677

ABSTRACT:
A package structure of light-emitting diode with an electrostatic protective diode is disclosed. The structure has a light-emitting diode, an electrostatic protective diode, an electrical & heat conductive pad, and an electrical & heat conductive base substrate. The light-emitting diode is flipped and with its p-electrode and n-electrode, respectively, mounted on the n-electrode of the electrostatic protective diode and the electrical & heat conductive pad by conductive bumps. The latter two are separated themselves by a gap or an insulation layer and both of them are mounted on and electrically connected to the electrical & heat conductive base substrate. The structure is then through a bonding wire bonding to a bonding pad and the electrical & heat conductive base structure, respectively, connected to a positive and a negative terminal of a DC power to implement the electrical connection. The foregoing bonding pad is located on the exposed portion of n-electrode of the electrostatic protective diode.

REFERENCES:
patent: 6084252 (2000-07-01), Isokawa et al.
patent: 6498355 (2002-12-01), Harrah et al.
patent: 6642072 (2003-11-01), Inoue et al.
patent: 6696704 (2004-02-01), Maeda et al.
patent: 6713877 (2004-03-01), Hirano et al.
patent: 20020179914 (2002-12-01), Sheu
patent: 11346007 (1999-12-01), None

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