Package of solid-state imaging device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Details

C257S678000

Reexamination Certificate

active

07391108

ABSTRACT:
Disclosed herein is a package of solid-state imaging device for enclosing the solid-state imaging device having a plurality of signal output pads for outputting image signals, provided correspondingly to each of a plurality of image outputs, including: a plurality of inner leads for effecting electrical connection with each of the plurality of signal output pads of the solid-state imaging device; a plurality of lead frames each having a same configuration with another, formed correspondingly to each of the plurality of inner leads as continuation therefrom; and a plurality of electrical connection means formed as continuously connected to each of the plurality of lead frames.

REFERENCES:
patent: 2001/0045640 (2001-11-01), Oida et al.
patent: 05122617 (1993-05-01), None

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