Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-05-25
2010-02-16
Lee, Eugene (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S447000, C257S448000, C257S738000, C257S773000, C257SE25032, C257SE27133
Reexamination Certificate
active
07663234
ABSTRACT:
A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
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Chen Ming-Chieh
Cheng Kuang-Chih
Lee Kevin
Pan Jui-Hsiang
Sun Joseph
Gumedzoe Peniel M
Lee Eugene
United Microelectronics Corp.
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