LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Package for semiconductor device with at least one through hole

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – With textured surface

Package for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package for semiconductor die containing symmetrical lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Package for semiconductor elements having thermal dissipation me

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Package for semiconductor power device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Package for stacked integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Package for storing light emitting element and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Package frame and semiconductor package using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package having a structure for stabilizing and/or impedance-matc

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Package having an opening in a surface thereof for mounting...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Package having Au layer semiconductor device having Au layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Package having bond-sealed underbump

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Package having exposed integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...

Package having exposed integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Package having shield case

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Package having very thin semiconductor chip, multichip...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Package housing multiple semiconductor dies

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Package housing multiple semiconductor dies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Package in package (PiP)