Package frame and semiconductor package using the same

Details Package frame and semiconductor package using the same Package frame and semiconductor package using the same

2006-06-27

2009-06-02

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257SE23061, C257S784000

Reexamination Certificate

active

07541668

ABSTRACT:
Provided are a lead frame and a semiconductor package which allows reliable attachment of a small-sized semiconductor chip requiring a large number of leads to a board while providing high heat dissipation capability. The semiconductor package includes leads, each having a top plate extending inward from the outside edge of a frame and a plurality of pillar-shaped portions supporting the top plates, a semiconductor chip attached onto edge portions of the leads, wires connecting the leads with corresponding bonding pad on the semiconductor chip, and a molding material encapsulating the semiconductor chip and the wires and parts of the leads so as to the bottom surfaces of the leads are exposed. Further, some embodiments have a conductive pad exhibiting higher heat dissipation.

REFERENCES:
patent: 6150709 (2000-11-01), Shin et al.
patent: 6281568 (2001-08-01), Glenn et al.
patent: 6424025 (2002-07-01), Liu
patent: 6927483 (2005-08-01), Lee et al.
patent: 6953988 (2005-10-01), Seo et al.
patent: 7087462 (2006-08-01), Park et al.
patent: 7338841 (2008-03-01), Lau
patent: 2005/0156291 (2005-07-01), Shiu et al.
patent: 2005/0206010 (2005-09-01), Noquil et al.

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