Package housing multiple semiconductor dies

Details Package housing multiple semiconductor dies Package housing multiple semiconductor dies

1995-03-13

1998-02-17

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257723, 257784, 257778, H01L 23495, H01L 2334, H01L 2348, H01L 2352

Patent

active

057194360

ABSTRACT:
A package housing multiple semiconductor die includes a leadframe having a paddle and a number of lead fingers. A flexible circuit is adhesively laminated to both sides of the paddle. A first semiconductor die is back-mounted to the bottom surface of the paddle and wire-bonded to the flexible circuit and the lead fingers. A second semiconductor die is back-mounted to the top surface of the paddle and to the flexible circuit. The dies are encapsulated in a security coating and encased in plastic.

REFERENCES:
patent: 5012323 (1991-04-01), Farnworth
patent: 5019893 (1991-05-01), Frank et al.
patent: 5198883 (1993-03-01), Takahashi et al.
patent: 5523608 (1996-06-01), Kitaoka et al.

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