Package having Au layer semiconductor device having Au layer

Details Package having Au layer semiconductor device having Au layer Package having Au layer semiconductor device having Au layer

1997-03-26

1999-10-12

Kelley, Nathan K.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

257782, 257751, H01L 2348

Patent

active

059659467

ABSTRACT:
A method of mounting a semiconductor device first forms a barrier layer on one surface of an semiconductor substrate made of Si. Then, a first Au layer is formed on the barrier layer. Accordingly, a semiconductor device is provided. The barrier layer is formed of metal for preventing mutual diffusion of Si in the Si semiconductor substrate with Au in the first Au layer at a high temperature of 600.degree. C. or higher. A step of acquiring a package substrate forms a metal coated layer on a base first and then forms a second Au layer on the surface of the metal coated layer. Then, the semiconductor device is placed on the package substrate with the first and second Au layers contacting with each other, and the semiconductor device and the package substrate are scrubbed against each other. Consequently, the first and second Au layers form Au--Au eutectic layer, thereby connect the semiconductor device to the package substrate.

REFERENCES:
patent: 3551997 (1971-01-01), Etter
patent: 3982908 (1976-09-01), Arnold
patent: 4068022 (1978-01-01), Glick
patent: 4480261 (1984-10-01), Hattori et al.
patent: 4757934 (1988-07-01), Greenstein
patent: 4772935 (1988-09-01), Lawler et al.
patent: 4835593 (1989-05-01), Arnold et al.
patent: 4935805 (1990-06-01), Calviello et al.
patent: 5047832 (1991-09-01), Tonai
patent: 5077599 (1991-12-01), Yano et al.
patent: 5134461 (1992-07-01), Yamakawa et al.
patent: 5559817 (1996-09-01), Derkits, Jr. et al.
patent: 5635764 (1997-06-01), Fujikawa et al.

Affiliated with

Also associated with

Rating

Package having Au layer semiconductor device having Au layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package having Au layer semiconductor device having Au layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package having Au layer semiconductor device having Au layer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-655566