Package housing multiple semiconductor dies

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257723, 257784, 257778, 257668, 438106, H01L 23495, H01L 2334, H01L 2348, H01L 2352

Patent

active

057931011

ABSTRACT:
A package housing multiple semiconductor die includes a leadframe having a paddle and a number of lead fingers. A flexible circuit is adhesively laminated to both sides of the paddle. A first semiconductor die is back-mounted to the bottom surface of the paddle and wire-bonded to the flexible circuit and the lead fingers. A second semiconductor die is back-mounted to the top surface of the paddle and to the flexible circuit. The dies are encapsulated in a security coating and encased in plastic.

REFERENCES:
patent: 5012323 (1991-04-01), Farnworth
patent: 5585668 (1996-12-01), Burns

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Package housing multiple semiconductor dies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package housing multiple semiconductor dies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package housing multiple semiconductor dies will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-391922

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.