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Multi-chip package type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Multi-chip package type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Multi-chip package with a plurality of chip pads arranged in...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Plural light emitting devices
Reexamination Certificate

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Multi-chip package with electrical interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Multi-chip package with high-speed serial communications...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Multi-chip package-type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Multi-chip packaged integrated circuit device for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Multi-chip packaged integrated circuit device for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Multi-chip packaging structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Multi-chip packaging using bump technology

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Multi-chip press-connected type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Multi-chip semiconductor arrangements using flip chip dies

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated...
Patent

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Multi-chip semiconductor chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Multi-chip semiconductor connector and method

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Multi-chip semiconductor connector assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Multi-chip semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Multi-chip semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Multi-chip semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Multi-chip semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Multi-chip semiconductor device and method for making the device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

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