Multi-chip semiconductor connector and method

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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C257S666000, C257S686000, C257SE23039

Reexamination Certificate

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07875964

ABSTRACT:
In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is suitable for attaching to a first semiconductor die and a second conductive strip that is attached suitable for attaching to a second semiconductor die.

REFERENCES:
patent: 4363076 (1982-12-01), McIver
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 5331235 (1994-07-01), Chun
patent: 5471369 (1995-11-01), Honda et al.
patent: 5677567 (1997-10-01), Ma et al.
patent: 6650019 (2003-11-01), Glenn et al.
patent: 2001/0017410 (2001-08-01), Akram
patent: 2002/0171130 (2002-11-01), Takahashi et al.
patent: 2005/0224945 (2005-10-01), Saito et al.

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