Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate
2011-01-25
2011-01-25
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With bumps on ends of lead fingers to connect to semiconductor
C257S666000, C257S686000, C257SE23039
Reexamination Certificate
active
07875964
ABSTRACT:
In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is suitable for attaching to a first semiconductor die and a second conductive strip that is attached suitable for attaching to a second semiconductor die.
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Carney Francis J.
Celaya Phillip
Fauty Joseph K.
Letterman James P.
St. Germain Stephen
Hightower Robert F.
Parekh Nitin
Semiconductor Components Industries L.L.C.
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