Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-11-20
2007-11-20
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE25018, C257S676000, C257S685000, C257S777000, C438S108000, C438S109000, C361S760000
Reexamination Certificate
active
10877325
ABSTRACT:
In one exemplary embodiment, a multi-chip semiconductor connector is utilized for forming a semiconductor package having a plurality of semiconductor die. The multi-chip semiconductor connector is utilized to mechanically attach the plurality of semiconductor die together and to provide electrical connection to the plurality of semiconductor die.
REFERENCES:
patent: 5530292 (1996-06-01), Waki et al.
patent: 5532512 (1996-07-01), Fillion et al.
patent: 6265760 (2001-07-01), Inaba et al.
patent: 6423102 (2002-07-01), Fukunaga et al.
patent: 6433422 (2002-08-01), Yamasaki
patent: 6458617 (2002-10-01), Liao et al.
patent: 6548911 (2003-04-01), Yu et al.
patent: 6650019 (2003-11-01), Glenn et al.
patent: 6713317 (2004-03-01), Knapp et al.
patent: 6906424 (2005-06-01), Kinsman
patent: 7008824 (2006-03-01), Akram
patent: 2002/0066950 (2002-06-01), Joshi
patent: 2004/0061221 (2004-04-01), Schaffer
patent: 2005/0224945 (2005-10-01), Saito et al.
Carney Francis J.
Celaya Phillip
Fauty Joseph K.
Letterman James P.
St. Germain Stephen
Chu Chris C.
Hightower Robert F.
Parker Kenneth
Semiconductor Components Industries L.L.C.
LandOfFree
Multi-chip semiconductor connector assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multi-chip semiconductor connector assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-chip semiconductor connector assemblies will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3839007