Multi-chip package type semiconductor device

Details Multi-chip package type semiconductor device Multi-chip package type semiconductor device

2005-04-19

2005-04-19

Zarneke, David A. (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S784000

Reexamination Certificate

active

06882056

ABSTRACT:
A multi-chip package type semiconductor device includes an insulating substrate having first and second conductive patterns thereon, a first semiconductor chip on the insulating substrate and having a first terminal pad and a relay pad isolated from the first terminal pad. The device further includes a second semiconductor chip on the first semiconductor chip having a second terminal pad. The first semiconductor chip is connected to the first pattern by a first bonding wire. The second semiconductor chip is connected to the second pattern by a second bonding wire, which connects the second pattern to the relay pad, and a third bonding wire, which connects the relay pad to the second terminal pad. The lengths of the first, second and third bonding wire are approximately the same.

REFERENCES:
patent: 5328079 (1994-07-01), Mathew et al.
patent: 5777345 (1998-07-01), Loder et al.
patent: 6148505 (2000-11-01), Fujishima
patent: 6215182 (2001-04-01), Ozawa et al.
patent: 6229217 (2001-05-01), Fukui et al.
patent: 6441501 (2002-08-01), Tseng et al.

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