Multi-chip package with high-speed serial communications...

Details Multi-chip package with high-speed serial communications... Multi-chip package with high-speed serial communications...

2004-05-07

2008-03-11

Clark, Sheila V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S723000

Reexamination Certificate

active

07342310

ABSTRACT:
A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.

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