Multi-chip package with a plurality of chip pads arranged in...

Details Multi-chip package with a plurality of chip pads arranged in... Multi-chip package with a plurality of chip pads arranged in...

2009-11-19

2011-12-06

Dickey, Thomas L (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

Plural light emitting devices

C257SE33002

Reexamination Certificate

active

08071989

ABSTRACT:
A circuit structure of a package carrier including a plurality of chip pads, a first electrode, a second electrode, a third electrode and a fourth electrode is provided. These chip pads are arranged in an M×N array. A first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad are disposed clockwise in the peripheral area of each chip pad in sequence. The orientations of each of the first, second, third, and fourth bonding pads of the (S−1)throw rotated by 90 degrees are equal to the orientations of each of the first, second, third and fourth bonding pads of the Sthrow, respectively. The first electrode is connected with each first bonding pad. The second electrode is connected with each second bonding pad. The third electrode is connected with each third bonding pad. The fourth electrode is connected with each fourth bonding pad.

REFERENCES:
patent: 2008/0191222 (2008-08-01), Lee
patent: WO 2007055457 (2007-05-01), None

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