Multi-chip semiconductor device

Details Multi-chip semiconductor device Multi-chip semiconductor device

1997-02-28

1999-03-23

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257705, 257706, 257707, 257712, 257796, H01L 2306, H01L 2310, H01L 2334, H01L 2328

Patent

active

058864083

ABSTRACT:
A semiconductor device including: a ceramic base board formed of A1N; a CPU chip and a CMU chip which are flip-chip bonded on a circuit board which includes the ceramic base board; SRAM chips which are die-bonded to the lower major surface of the circuit board; first heat conductive blocks adhesively attached to the CPU chip and the CMU chip; second heat conductive blocks adhesively attached to the upper major surface of the A1N ceramic base board; a resin package; and a heat sink which, adhesively attached on the upper major surface of the resin package, is in close contact with the first heat conductive blocks and the second heat conductive blocks. The heat generated by the CPU chip and the CMU chip is transferred to the heat sink via the first heat conductive blocks and is radiated from the heat sink. The heat generated by the SRAM chips is transferred to the heat sink via the A1N ceramic base board and the second heat conductive blocks and is radiated from the heat sink.

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patent: 4612601 (1986-09-01), Watari
patent: 4612978 (1986-09-01), Cutchaw
patent: 4644385 (1987-02-01), Nakanishi et al.
patent: 4878108 (1989-10-01), Phelps, Jr. et al.
patent: 5089936 (1992-02-01), Kojima et al.
patent: 5175613 (1992-12-01), Barker, III et al.
patent: 5184211 (1993-02-01), Fox
patent: 5345107 (1994-09-01), Daikoku et al.

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