Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent
1998-03-02
2000-11-21
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
257778, 257724, H01L 2348, H01L 2352, H01L 2940
Patent
active
061507245
ABSTRACT:
A bump-bonded multi-chip flip-chip device (100) is formed by manufacturing a mother chip (102) having a first set (207) of bumps (212) and a second set (209) of bump contacts (210). A daughter chip (104) is also formed which has conductive bumps (312). The daughter chip (104) and the mother chip (102) are placed face-to-face and contact is made between the daughter chips bumps (312) and the mother chips bump contact regions (210). After interconnection of the daughter chip (104) and the mother chip (102), the mother chip (102) is contacted to an IC package (106) using the bumps (212). The package (106) uses a plurality of metallic layers interconnected selectively by conductive vias in order to route signals between the mother chip (102), the daughter chip (104), and external terminals (112) of the package (106).
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DeHaven Robert K.
Johnston James P.
Marietta Bryan D.
Wenzel James F.
Clark Sheila V.
Motorola Inc.
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