Multi-chip semiconductor chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

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257685, 257686, 257724, H01L 2334

Patent

active

058348433

ABSTRACT:
A semiconductor device including a plurality of chip units each defined by a side wall and arranged in a state such that a side wall of a chip unit abuts a corresponding side wall of an adjacent chip unit, and an interconnection structure for interconnecting a plurality of terminals of a side wall of a chip unit to corresponding terminals of a side wall of an adjacent chip unit that abuts the chip unit at the respective side walls.

REFERENCES:
patent: 4860444 (1989-08-01), Herrell et al.
patent: 4990462 (1991-02-01), Silwa, Jr.
patent: 5406027 (1995-04-01), Matsumoto et al.

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