LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink assembly for solid state devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink assembly for solid state devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink assembly including a printed wiring board and a metal

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink assembly manufactured of thermally conductive polymer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink assembly with snap-in cover plate having multiple pres

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heat sink board and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Heat sink bonded to a die paddle having at least one aperture

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink clip assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink design using clad metal

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink dissipator for adapting to thickness change of a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink fin assembly for cooling an LSI package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heat sink for a high capacity thin module system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink for plastic casings

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink for semiconductor components or similar devices,...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Heat sink for semiconductor device assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Heat sink for semiconductor device assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heat sink for semiconductors and manufacturing process thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink for use in cooling an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink formed of diamond-containing composite material...