Heat sink assembly for solid state devices

Details Heat sink assembly for solid state devices Heat sink assembly for solid state devices

1993-07-26

1995-03-14

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257706, 257718, 257719, 257727, H01L 2302, H01L 2342, H01L 2344, H01L 2340

Patent

active

053979192

ABSTRACT:
A heat sink assembly adapted for use with an electronic device package such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base of a finned heat sink adapted to be received in a threaded bore of an adaptor which mounts onto the electronic device package. Desired thermal coupling is achieved by screwing down the heat sink in biasing engagement with the package. Alternate embodiments show the heat sink which has a snap on flange to attach the heat sink to the adaptor and the adaptor extending down to engage with the socket in which the microprocessor is installed.

REFERENCES:
patent: 4345267 (1982-08-01), Corman et al.
patent: 4396935 (1983-08-01), Schuck
patent: 4593342 (1986-06-01), Lindsay
patent: 4660123 (1987-04-01), Hermann
patent: 5053853 (1991-10-01), Haj-Ali-Ahmadi et al.

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